EE215D Analog Microsystem(A/D)
Table of contents
Table of Contents
CHAPTER 1: INTRODUCTION TO DATA CONVERSION AND PROCESSING - Page 1
CHAPTER 2: BASIC SAMPLING CIRCUITS
- 2.1 General Considerations - Page 7
- 2.2 Performance Metrics - Page 11
- 2.3 Sampling Switches - Page 13
- 2.3.1 MOS Switches - Page 14
- 2.3.2 Diode Switches - Page 19
- 2.3.3 Comparison of MOS and Diode Switches - Page 23
- 2.3.4 Improvements in MOS Switch Performance - Page 24
- References - Page 27
CHAPTER 3: SAMPLE-AND-HOLD ARCHITECTURES
- 3.1 Conventional Open-Loop Architecture - Page 29
- 3.2 Conventional Closed-Loop Architecture - Page 31
3.3 Open-Loop Architecture with Miller Capacitance - Page 33
3.4 Multiplexed-Input Architectures - Page 35
3.5 Recycling Architecture - Page 39
3.6 Switched-Capacitor Architecture - Page 40
3.7 Current-Mode Architecture - Page 42
- References - Page 43
CHAPTER 4: BASIC PRINCIPLES OF DIGITAL-TO-ANALOG CONVERSION - Page 45
- 4.1 General Considerations - Page 45
- 4.2 Performance Metrics - Page 47
- 4.3 Reference Multiplication and Division - Page 49
- 4.3.1 Voltage Division - Page 50
- 4.3.2 Current Division - Page 55
- 4.3.3 Charge Division - Page 63
- 4.4 Switching and Logical Functions in DACs - Page 70
- References - Page 77
CHAPTER 5: DIGITAL-TO-ANALOG CONVERTER ARCHITECTURES - Page 79
- 5.1 Resistor-Ladder DAC Architectures - Page 79
- 5.2 Current-Steering Architectures - Page 84
- 5.2.1 R-2R-Network Based Architectures - Page 84
- 5.2.2 Segmented Architectures - Page 90
- References - Page 94
CHAPTER 6: ANALOG-TO-DIGITAL CONVERTER ARCHITECTURES - Page 96
- 6.1 General Considerations - Page 96
- 6.2 Performance Metrics - Page 99
- 6.3 Flash Architectures - Page 101
- 6.3.1 Reference Ladder DC and AC Bowing - Page 103
- 6.3.2 Nonlinear Input Capacitance - Page 106
- 6.3.3 Kickback Noise - Page 107
- 6.3.4 Sparkles in Thermometer Code - Page 108
- 6.3.5 Metastability - Page 110
- 6.3.6 Slew-Dependent Sampling Point - Page 112
- 6.3.7 Clock Jitter and Dispersion - Page 112
- 6.3.8 Gray Encoding - Page 114
- 6.4 Two-Step Architectures - Page 116
- 6.4.1 Effect of Nonidealities - Page 121
- 6.4.2 Two-Step Recycling Architecture - Page 124
- 6.4.3 Two-Step Subranging Architecture - Page 125
- 6.5 Interpolative and Folding Architectures - Page 126
- 6.5.1 Interpolation - Page 127
- 6.5.2 Folding Architectures - Page 132
- 6.5.3 Folding with Interpolation - Page 136
- 6.6 Pipelined Architectures - Page 140
- 6.7 Successive Approximation Architectures - Page 143
- 6.8 Interleaved Architectures - Page 147
- References - Page 149
CHAPTER 7: BUILDING BLOCKS OF DATA CONVERSION SYSTEMS - Page 153
- 7.1 Amplifiers - Page 153
- 7.1.1 Open-Loop Amplifiers - Page 153
- 7.1.2 Closed-Loop Amplifiers - Page 160
- 7.1.3 Operational Amplifiers - Page 164
- 7.1.4 Gain Boosting Techniques - Page 171
- 7.1.5 Common-Mode Feedback - Page 172
- 7.2 Comparators - Page 177
- 7.2.1 Bipolar Comparators - Page 181
- 7.2.2 CMOS Comparators - Page 188
- 7.2.3 BiCMOS Comparators - Page 191
- References - Page 195
- 7.1 Amplifiers - Page 153
CHAPTER 8: PRECISION TECHNIQUES - Page 198
- 8.1 Comparator Offset Cancellation - Page 198
- 8.1.1 Input Offset Storage - Page 199
- 8.1.2 Output Offset Storage - Page 201
- 8.1.3 Multistage Offset Storage - Page 202
- 8.1.4 Comparators Using Offset-Cancelled Latches - Page 206
8.2 Op Amp Offset Cancellation - Page 208
- 8.3 Calibration Techniques - Page 211
- 8.3.1 DAC Calibration Techniques - Page 211
- 8.3.2 ADC Calibration Techniques - Page 218
8.4 Range Overlap and Digital Correction - Page 224
- References - Page 229
- 8.1 Comparator Offset Cancellation - Page 198
- CHAPTER 9: TESTING AND CHARACTERIZATION - Page 232
- 9.1 General Considerations - Page 232
- 9.2 Sampling Circuits - Page 234
- 9.3 D/A Converters - Page 239
- 9.4 A/D Converters - Page 239
- 9.4.1 Static Testing - Page 239
- 9.4.2 Dynamic Testing - Page 241
- INDEX - Page 252